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Journal Articles

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Guisheng Gan, Donghua Yang, Yi-ping Wu, Xin Liu, Pengfei Sun, Daquan Xia, Huadong Cao, Liujie Jiang, Mizhe Tian

Soldering & Surface Mount Technology (2021) 33 (2): 94–104.

https://doi.org/10.1108/SSMT-12-2019-0046

Published: 14 January 2021

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Journal Articles

Influence of thermal shock cycles on Sn-37Pb solder bumps

Guisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping Wu

Soldering & Surface Mount Technology (2019) 31 (2): 85–92.

https://doi.org/10.1108/SSMT-08-2018-0026

Published: 20 February 2019

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Journal Articles

Thermal profiling: a reflow process based on the heating factor

Jin Gang Gao, Yi Ping Wu, Han Ding, Nian Hong Wan

Soldering & Surface Mount Technology (2008) 20 (4): 20–27.

https://doi.org/10.1108/09540910810902679

Published: 19 September 2008

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