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Journal Articles

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng, Xin Liu

Soldering & Surface Mount Technology (2023) 35 (4): 189–198.

https://doi.org/10.1108/SSMT-07-2022-0047

Published: 24 January 2023

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Journal Articles

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Guisheng Gan, Shiqi Chen, Liujie Jiang, Qianzhu Xu, Tian Huang, Dayong Cheng, Xin Liu

Soldering & Surface Mount Technology (2023) 35 (3): 155–165.

https://doi.org/10.1108/SSMT-04-2022-0027

Published: 25 October 2022

View article titled, Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

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Journal Articles

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Guisheng Gan, Shiqi Chen, Liujie Jiang, Cong Liu, Tian Huang, Peng Ma, Dayong Cheng, Xin Liu

Soldering & Surface Mount Technology (2023) 35 (3): 143–154.

https://doi.org/10.1108/SSMT-07-2022-0046

Published: 30 September 2022

View article titled, Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

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Journal Articles

Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

Guisheng Gan, Shiqi Chen, Liujie Jiang, Zhaoqi Jiang, Cong Liu, Peng Ma, Dayong Cheng, Xin Liu

Soldering & Surface Mount Technology (2023) 35 (2): 95–105.

https://doi.org/10.1108/SSMT-04-2022-0028

Published: 26 August 2022

View article titled, Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

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Journal Articles

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Guisheng Gan, Donghua Yang, Yi-ping Wu, Xin Liu, Pengfei Sun, Daquan Xia, Huadong Cao, Liujie Jiang, Mizhe Tian

Soldering & Surface Mount Technology (2021) 33 (2): 94–104.

https://doi.org/10.1108/SSMT-12-2019-0046

Published: 14 January 2021

View article titled, Property of Sn-37Pb solder bumps with different diameter during thermal shock

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Journal Articles

Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

Gui-sheng Gan, Liujie Jiang, Shiqi Chen, Yongqiang Deng, Donghua Yang, Zhaoqi Jiang, Huadong Cao, Mizhe Tian, Qianzhu Xu, Xin Liu

Soldering & Surface Mount Technology (2021) 33 (4): 224–231.

https://doi.org/10.1108/SSMT-08-2020-0035

Published: 13 January 2021

View article titled, Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

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Journal Articles

Influence of thermal shock cycles on Sn-37Pb solder bumps

Guisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping Wu

Soldering & Surface Mount Technology (2019) 31 (2): 85–92.

https://doi.org/10.1108/SSMT-08-2018-0026

Published: 20 February 2019

View article titled, Influence of thermal shock cycles on Sn-37Pb solder bumps

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Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

Influence of thermal shock cycles on Sn-37Pb solder bumps

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