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Journal Articles

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

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Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng, Xin Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (4): 189–198.
https://doi.org/10.1108/SSMT-07-2022-0047
Published: 24 January 2023
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Journal Articles

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

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Guisheng Gan, Shiqi Chen, Liujie Jiang, Qianzhu Xu, Tian Huang, Dayong Cheng, Xin Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (3): 155–165.
https://doi.org/10.1108/SSMT-04-2022-0027
Published: 25 October 2022
View article titled, Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
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Journal Articles

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

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Guisheng Gan, Shiqi Chen, Liujie Jiang, Cong Liu, Tian Huang, Peng Ma, Dayong Cheng, Xin Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (3): 143–154.
https://doi.org/10.1108/SSMT-07-2022-0046
Published: 30 September 2022
View article titled, Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted
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Journal Articles

Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

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Guisheng Gan, Shiqi Chen, Liujie Jiang, Zhaoqi Jiang, Cong Liu, Peng Ma, Dayong Cheng, Xin Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (2): 95–105.
https://doi.org/10.1108/SSMT-04-2022-0028
Published: 26 August 2022
View article titled, Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
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