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Journal Articles

A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints

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Ezzatul Farhain Azmi, Abdullah Aziz Saad, Yasemin Tabak, Fayaz Hussain, Ahmad Azmin Mohamad
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (2): 121–130.
https://doi.org/10.1108/SSMT-08-2025-0037
Published: 17 December 2025
View article titled, A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints
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Journal Articles

Mechanical reliability of self-aligned chip assembly after reflow soldering process

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Mohd Najib Ali Mokhtar, M.Z. Abdullah, Abdullah Aziz Saad, Fakhrozi Cheani
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (1): 9–17.
https://doi.org/10.1108/SSMT-12-2019-0042
Published: 28 April 2020
View article titled, Mechanical reliability of self-aligned chip assembly after reflow soldering process
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Journal Articles

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

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Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok, Norinsan Kamil Othman
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 109–124.
https://doi.org/10.1108/SSMT-08-2018-0024
Published: 18 December 2018
View article titled, Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
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Journal Articles

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

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Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 1–13.
https://doi.org/10.1108/SSMT-04-2017-0011
Published: 09 January 2018
View article titled, SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
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