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Journal Articles

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim

Soldering & Surface Mount Technology (2020) 32 (3): 157–164.

https://doi.org/10.1108/SSMT-07-2019-0024

Published: 11 February 2020

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Journal Articles

SAC–xTiO₂ nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman

Soldering & Surface Mount Technology (2018) 30 (1): 1–13.

https://doi.org/10.1108/SSMT-04-2017-0011

Published: 09 January 2018

View article titled, SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

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Journal Articles

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, Roslina Ismail

Soldering & Surface Mount Technology (2017) 29 (2): 110–117.

https://doi.org/10.1108/SSMT-08-2016-0017

Published: 03 April 2017

View article titled, Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

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