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Journal Articles

Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire

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Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, R. Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 194–202.
https://doi.org/10.1108/SSMT-07-2017-0020
Published: 21 December 2017
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Journal Articles

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

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Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, Roslina Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 110–117.
https://doi.org/10.1108/SSMT-08-2016-0017
Published: 03 April 2017
View article titled, Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
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