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Journal Articles

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail

Soldering & Surface Mount Technology (2021) 33 (1): 47–56.

https://doi.org/10.1108/SSMT-11-2019-0035

Published: 08 July 2020

View article titled, Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

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Journal Articles

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar

Soldering & Surface Mount Technology (2019) 31 (2): 102–108.

https://doi.org/10.1108/SSMT-06-2018-0019

Published: 02 April 2019

View article titled, Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Add to Citation Manager for Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition