The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.
Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach.
Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight.
Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications.
