As an emerging interconnection technology, microspring array pins exhibit superior resistance to mechanical shock compared to traditional ball grid array or column array. However, high-impact dynamic loads in aerospace environments are prone to inducing microspring fracture, thereby compromising the operational safety of electronic systems. This study aims to post-printed circuit board-assembly reinforcement schemes for large-scale integrated circuits to enhance the anti-vibration performance of microspring array interconnections under extreme service conditions.
Three configurations (unreinforced, corner epoxy bonding and corner L-shaped epoxy bonding) were compared. Finite element simulation – incorporating modal, random and sinusoidal vibration analyses – was used to screen the optimal reinforcement scheme. Daisy-chain circuits facilitated in-situ monitoring, while vibration tests conducted in accordance with aerospace standards validated the reliability of the optimized method.
The corner L-shaped reinforcement scheme demonstrated superior performance. Modal analysis revealed that the first-order natural frequency increased from 419.33 Hz to 589.07 Hz. Under random vibration, simulation results showed the maximum stress of microsprings was reduced to 37.047 MP. Sinusoidal vibration tests minimized peak stress to 6.034 MPa. Post-vibration measurements indicated the resistance change of daisy-chain circuits was = 6%, confirming the scheme’s suitability for aerospace applications.
The authors present results with advanced simulation method, the results of the simulation is verifired with independently experiment.
