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Volume 4, Issue 3
1 March 1992
Soldering & Surface Mount Technology Cover Image for Volume 4, Issue 3
Review Article| March 01 1992

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Colin Lea
National Physical Laboratory
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Bob Willis
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Mike Judd
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Bob Willis
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John Beamish
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Karen Moore
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1992
Soldering & Surface Mount Technology (1992) 4 (3): 55–61.
https://doi.org/10.1108/eb037803

This conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first conference was on Controlled Atmosphere Soldering and the third will be on New Solvents.

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© MCB UP Limited
1992
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