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Volume 3, Issue 3
1 March 1991
Soldering & Surface Mount Technology Cover Image for Volume 3, Issue 3
Review Article| March 01 1991

SMART group news

Bob Willis;
Bob Willis
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Glyn Jackson;
Glyn Jackson
Multitone
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Colin Lea;
Colin Lea
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C.O Mathuna;
C.O Mathuna
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Padraig Healy
Padraig Healy
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1991
Soldering & Surface Mount Technology (1991) 3 (3): 49–53.
https://doi.org/10.1108/eb037768

Electronics exhibitions are the same the world over, very tiring affairs. If your stand is busy, time flies; if not, the strain is more noticeable.

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© MCB UP Limited
1991
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Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating
Reliability study of large-area sintered Cu for power electronic packaging

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