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Volume 5, Issue 1
1 January 1993
Soldering & Surface Mount Technology Cover Image for Volume 5, Issue 1
Review Article| January 01 1993

Industry news Available to Purchase

Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1993
Soldering & Surface Mount Technology (1993) 5 (1): 69–70.
https://doi.org/10.1108/eb037818

Peter Ongley has joined Alpha Metals as Manager of the company's Advanced Products Division. He will be responsible for the technical support and marketing of polymer and silica‐glass die attach adhesives, superconductors, Gel‐Packs (chip carriers) and the advancement of related product ranges.

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© MCB UP Limited
1993
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

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