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Volume 5, Issue 1
1 January 1993
Soldering & Surface Mount Technology Cover Image for Volume 5, Issue 1
Review Article| January 01 1993

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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1993
Soldering & Surface Mount Technology (1993) 5 (1): 71–72.
https://doi.org/10.1108/eb037819

In response to increasing concerns about workers' exposure to lead during soldering operations, Dage Intersem have introduced two new formulations of pure tin cored wire, manufactured by AIM Products Inc.

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© MCB UP Limited
1993
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

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