Development of a Novel No‐clean Low Residue Solder Paste for Fine Pitch Applications

An experiment was conducted to examine the effect of post‐reflow no‐clean solder paste residue on near‐end and far‐end signal crosstalk due to changes in dielectric constant and leakage resistance in the circuit environment. Additionally, the effect of different frequency levels on post‐reflow residue was examined. Data from these studies are presented in this paper.