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Volume 11, Issue 1
1 April 1999
Soldering & Surface Mount Technology Cover Image for Volume 11, Issue 1
Article Contents
Non Article| April 01 1999

SMART diary Free

Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1999
Soldering & Surface Mount Technology (1999) 11 (1)
https://doi.org/10.1108/ssmt.1999.21911aab.003

SMART diary

1999

March 10SMART Seminar, CleaningTBA

March 24SMART Seminar,ComponentsMilton Keynes

April 22SMART Seminar, COB,Advanced PackagingTBA

May 13SMART Seminar & WorkshopMidlandsRework & Repair

© MCB UP Limited
1999
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

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International Journal of Social Economics (September,2016)
Keynes and the future
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