Issues

Appointments

Indium Corporation appoints new field sales engineer

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New appointments at DEK

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Speedline Technologies selects new vice president of Europe

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ESEC Zevatech UK operations expand

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Don Eisenberg promoted to chief operating officer

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Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly

M.G. Firmstone; P.M. Bartholomew; D.J.J. Lowrie; S.H. Mannan; D.A. Hutt
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The impact of temperature and humidity conditions on surface insulation resistance values for various fluxes

Christopher Hunt; Ling Zou
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An evaluation of the effect of ageing on the cleanability of solder flux residues

L. Zou; M. Duˇsek; C.P. Hunt; B.D. Dunn
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Optimizing the reflow profile via defect mechanism analysis

Ning‐Cheng Lee
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Solder joint reliability of plastic ball grid array packages

Chong Hua Zhong; Sung Yi
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Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Aulis Tuominen; Eero Ristolainen; Ville Lehtinen
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Company profile

BTU Europe Ltd, Farnborough, Hampshire, England

Lorna Cullen
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Editorial

Electronics - the history of the future

Phil G.B. Hamilton
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Exhibitions and conferences

Exhibitions and conferences

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Industry news

Packaging Solutions' technical division increases product range

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Who's in and who's out in the electronics manufacturers job market?

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Major investment at DEK screens

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SMT Dynamics and Blackfox Technology Group join forces

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Multicore and Concoat announce a global partnership

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Polar Instruments and Fabmaster sign worldwide OEM agreement

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Mydata opens UK technology centre

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Vision expands US manufacturing operation

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Intelliplace acquired by US pick and place manufacturer

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Speedline Technologies acquires printer division of Quad Systems for $14.8 million

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Karavale's expansion creates 600 new jobs

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Dover Soltec changes name worldwide to Vitronics Soltec

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Intelliplace strengthen European support

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International diary

International diary

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International institute news

Hutchins grant accepting applicants

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Attend next year's Pan-Pac

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IPC releases Spanish version of IPC-A-610B

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SMI changes name to SMTA International

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SMEMA and IPC boards give preliminary approval for merger plans

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SMTA International show scheduled for 1999

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SMC announces student paper award winners for 1998

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ITRI releases BGA guidelines report

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IPC SMEMA council unveils plans for new electronics assembly process technology show

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Internet commentary

Squeaky clean...

Brian Ellis
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New products

Heraeus speeds production with new SMD adhesive

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Intelliplace introduces the Inoplacer automated placement machine

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Twin-component solvent free silicone coating from Dow Corning

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Enhancements strengthen ProFlow benefits

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Ultra fast, solvent free Dymax conformal coatings

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New 'ActiveTest' software from JTAG technologies

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Intelligent Reasoning Systems adds lead-level inspection to its automated optical inspection systems

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Qualitek new product Stencil Kleen SK11 and SK44

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Excellon Automation introduces compact router for populated board applications

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New technology boosts Cobar materials performance

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Loranger International Corporation fine pitch sockets now available from Production Test Systems Ltd

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Convenient, low-cost screen washer from DEK Albany

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Microtech introduces OSP process to eliminate 'tombstoning'

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High thermally conductive adhesive for high power devices

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MPM's rheometric pump print head improves stencil printing consistency

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Effective cooling provided by BTU's proprietary eductor system

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New component inspection technology from General Scanning

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BTU introduces new controlled atmosphere furnace

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New no-clean, low solids liquid fluxes from Heraeus ready to use in air and nitrogen wave soldering applications

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Seminars and training courses

Seminars and training courses

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SMART news

SMART diary

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The SMART Group announces new fellowship award scheme

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European Surface Mount Conference

Mike Judd
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