SMC announces student paper award winners for 1998
IPC
SMC announces student paper award winners for 1998
Keywords Awards, SMC
The winners of the second annual Surface Mount Council (SMC) Student Paper Awards have been announced. Award recipients were honored in August at the opening ceremony of Surface Mount International '98 in San Jose, California.
The SMC Student Paper Award recognizes technical excellence and is intended to foster the development of closer ties between the electronics industry and universities.
Winners of the award must author papers on surface mount or related technologies.
This year's award winners are all students at Georgia Tech in Atlanta, Georgia:
1st Place "In process stress analysis of flip chip assemblies during underfill cure" Prema Palaniappan
2nd Place "Enhancement of underfill encapsulates for flip chip technology" Michael B. Vincent
3rd Place "Effect of solder paste residues on RF signal integrity" Brian A. Smith
Sponsors for the 1998 SMC Student Paper Award are Camelot System, Heller Industries, Philips Industrial Automation, Surface Mount Technology Association (SMTA), Speedline Technologies,Trek Industries, Unicam Software, Inc., Universal Instruments and Zevatech, Inc.
Award winners received travel expenses to receive their award, a plaque and a monetary prize: $3,000 for first place, $2,000 for second and $1,000 for third.
For more information,contact IPC vice president of technical programs Dave Bergman at +1 (847)790-5371, or e-mail DavidBergman@ipc.org
