Skip to Main Content
M.G. Firmstone
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly

Available to Purchase
M.G. Firmstone, P.M. Bartholomew, D.J.J. Lowrie, S.H. Mannan, D.A. Hutt
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1): 8–12.
https://doi.org/10.1108/09540919910254633
Published: 01 April 1999
View article titled, Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly
Open the PDF for Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly in another window
Add to Citation Manager for Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly
Journal Articles

New High Thermal Conductivity Thermoplastics for Power Applications

Available to Purchase
R.L. Dietz, D. Peck, P.J. Robinson, M.G. Firmstone, P.M. Bartholomew, G. Paterson
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1997) 9 (2): 55–57.
https://doi.org/10.1108/09540919710195172
Published: 01 December 1997
View article titled, New High Thermal Conductivity Thermoplastics for Power Applications
Add to Citation Manager for New High Thermal Conductivity Thermoplastics for Power Applications
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal