Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly

The benefits of a “no flow” process have been well documented in the recent past. The limitations of the previously reported materials in current use have been overcome via a unique chemistry which can be tailored to the application. Room temperature storage, effective fluxing, coupled with minimal outgassing, and a choice of reworkability after reflow or, if rework is not required, a full cure, can now be achieved within a single materials technology. This paper describes the properties of the new family of materials compared to conventional post‐deposited underfills. The development sequence and the procedure for characterisation of material properties, including the evaluation of the effectiveness of the fluxing action on a range of solder alloys, is documented. A typical application is described, outlining how a minimum of two process steps can be eliminated and how improvements in materials handling, process robustness, and ultimate yield, have been realised. A simple rework regime is also proposed, and the almost “drop in replacement” aspect of the new material is discussed.