Chip Scale Packaging: Design, Materials, Processes and Reliability

Chip Scale Packaging: Design, Materials, Processes and Reliability

John Lau and Ricky LeeMcGraw-HillHardcover, 400 pagesPrice £75ISBN: 0070383049

Keyword Chipscale packaging

Yet another book from the pen of John Lau, ably supported by Ricky Lee. I have reviewed a number of books from this author in the past and each has in my opinion been of great value to the industry. The partnership with Ricky based in Hong Kong provides an opportunity for a worldwide perspective. It has been a number of years since this reviewer worked at the Hong Kong University. Ricky is a very helpful and energetic engineer, which comes, across in the text.

Just like John's book on BGA Technology, this CSP reference is very timely as the focus of the industry is on this next step in surface mount technology. The CSP roller coaster is, in part, being driven by the problems still associated with KGD (known good die). CSP is a relatively simple technology from an assembly point of view and that is one of the few criticisms of this new book.

Where is the chapter on printed board assembly covering printing, placement, reflow, rework and inspection? I feel that this text would have benefited greatly from a short chapter on assembly and soldering. It was a key feature to many process engineers with The BGA Technology Handbook. Apart from these minor criticisms the book runs for just under 600 pages, with each of the 36 chapters well illustrated for easy reference. Most of the chapters cover the different CSP options, each broken down into sections covering design, materials,fabrication, reliability and advantages of the different CSP styles.

It is worth reading to be ready for what our friends in the design departments have in store for us in manufacture.