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IPC honours best paper awards at APEX 2001

Keywords: IPC, Awards

IPC has recognised the winners of this year's Best US and International Paper awards at IPC SMEMA Council's Electronics Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA.

Brian Smith, from Siemens Energy and Automation (EAE) Group in Atlanta, GA,received the award for Best US Paper for Initial Characterization of High Yield 0201 Processing.

Steve Harris, from Solectron Corporation in Dunfermline, Scotland, accepted the Best International Paper award on behalf of a consortium, including Solectron Scotland, Alcatel Microelectronics, Alcatel Space Industries, Alcatel Bell, IMEC/TFCG, Thomas Walter and TUB (University of Berlin) for Standard SMT Process for Flip Chip Assembly on FR4 Substrates.

IPC awarded each winner with a $1,000 in cash and a commemorative plaque.

Copies of the winning papers can be downloaded from www.GoAPEX.org

Further details about the authors: Clint Gendusa, IPC media relations manager. Tel: +1 847 790 5371; E-mail: clintgendusa@ipc.org

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