Issues

Appointments

Firmstone opens Thermoset office in Europe

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New appointments in Automation's sales and customer support team

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Association news

IPC. IPC honours best paper awards at APEX 2001

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SMART Group. Japan lead-free mission

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SMART Group. "lead-free update 2001"

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IPC. IPC market research councils merge

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SMART Group. European Conference – a sold-out success

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Stud bump bond packaging with reduced process steps

Zhaowei Zhong
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Effects of Pb contamination on the eutectic Sn‐Ag solder joint

S. Choi; T.R. Bieler; K.N. Subramanian; J.P. Lucas
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A high‐performance lead‐free solder – the effects of In on 99.3Sn/0.7Cu

Jennie S. Hwang; Zhenfeng Guo; Holger Koenigsmann
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Reliability of FCOB with and without encapsulation

Zhaowei Zhong
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Critical factors affecting paste flow during the stencil printing of solder paste

R. Durairaj; T.A. Nguty; N.N. Ekere
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Bending and twisting of cylindrical solder interconnections with creep

John H. Lau
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Exhibitions/conferences

Second APEX 2001 a success

Mike Judd
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Call for papers

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Industry news

PMJ automec Corporation expands its UK headquarters

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Siroyan to sponsor Young Electronic Design Awards: programme to encourage young people into technology careers

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Vitronics Soltec kicks off European Advanced Technology Tour

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Mask Technology awarded patent for PPT solid solder deposit technology

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3D-PC technology

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Two CDs for the price of one

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Hansatech offers X-ray inspection as part of its EMS provider package

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Qualiteks European operation expands

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Assembléon to keep customer show on the road

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NPL participate in EMAP conference in Hong Kong

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Viscom announces global expansion in facilities and personnel

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International Diary

International Diary

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Internet commentary

How little, mark! that portion of the ball, Where, faint at best, the beams of science fall

Brian Ellis
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New products

GenRad's new Summit 750 improves productivity

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Valor announces new release of Trilogy 5000 CAM system

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Contax Component Placement with the Contact 3Z

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MVP introduces dynamic process control

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Water-based cleaner for stencil underside wiping

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Qualitek introduces Delta 691 no-clean solder paste

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Parkheath Soldering Technologies enhances its portfolio

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OSP-1 advanced programmable clinch option for odd-form placement

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Automatic dispenser has manual vacuum pick-up pencil

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New benchtop robot to replace and remove components

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Automation offer "reworked" rework station

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Teradyne expands the INTEGRA J750 family of test systems

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Reports/publications

Electronics and Economics in Eastern Europe

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