Water-based cleaner for stencil underside wiping
Water-based cleaner for stencil underside wiping
Keywords: Wack Chemie, Cleaning, Stencil printing
ZESTRON®, the business division of Dr O.K. Wack Chemie GmbH, has introduced VIGON® SC 200 as the first water-based cleaner for underside wiping in stencil printers. The cleaner reliably removes solder paste residues from the stencil during the printing process. This has been proven and confirmed by DEK Printing GmbH.
Leading SMT manufacturers have been using the product already for a while in their production and successfully improved the reliability of their printing processes.
Supported by the vacuum drying system, the water-based product dries as fast as a solvent based cleaner. Compared with other products VIGON® SC 200 has no flash point and meets all safety requirements.
VIGON® SC 200 is a proven media for the removal of SMT-adhesives and solder pastes in water-based spray-in-air and ultrasonic applications. Using the product also for stencil underside wiping enables the use of one product in multiple applications.
Further details: Dr O.K. Wack Chemie GmbH. Tel: +49 841 635 62; Fax: +49 841 635 40.
