Mask Technology awarded patent for PPT solid solder deposit technology

Mask Technology awarded patent for PPT solid solder deposit technology

Keywords: Mask Technology, Patents

Mask Technology, Inc. has been awarded a fifth patent associated with their PPT Solid Solder Deposit technology. PPT is a method of forming metal deposits for electronic interconnections and eliminates solder paste at assembly. Originally employed in the formation of "flat pads" on the bare printed circuit board, the technology is now used for wafer bumping and in the formation of solder spheres on components. Paste related defects including shorts, skewing and voids are virtually eliminated.