SMT/HYBRID/PACKAGING 2001 remains strong

SMT/HYBRID/PACKAGING 2001 remains strongKeywords: Surface mount technology, Packaging

Despite the current gloom in the electronics industry, SMT/HYBRID/PACKAGING 2001 celebrated another highly successful three-day event.

The exhibition occupied 25,000sqm of floor space and comprised 604 exhibitors from 21 countries, representing a broad spectrum of the assembly and microelectronics communities. A total of 35 per cent of the exhibitors came from outside Germany.

With approximately 25,000 visitors, the exhibition maintained the high visitor levels achieved last year. According to preliminary reports, the exhibitors were extremely satisfied with the number and quality of contacts. As expected, the two fully functional assembly lines "Leadfree SMD and flip chip soldering line" and "SMD adhesive line" as well as the live bench-mark test were particularly interesting to the visitors.

The concurrent conference counted 554 attendees. Emulating the international opening session on "Surface Mount Technology – Area Array Packaging",the tutorials covered topics such as "Leadfree soldering" and "Soldering and adhesive assembly technologies for complex modules".

The next SMT/HYBRID/PACKAGING event will be held 18-20 June 2002.