Issues

Appointments

Andrews resigns as ITRI CEO

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Stan Renals joins Indium as product manager, advanced technologies, for Interconnect Business Unit

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Product management

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MV Technology announces key managerial appointments

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New Face at Nissei-Sangyo

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Business development

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Parkheath expands sales and service in Scotland

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"Old friend" returns to Automation as managing director

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New appointments at Dover Technologies

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Asymtek names Lisa Ryan general manager for Europe

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Marketing management

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Customer commitment and focus from MYDATA

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Association news

NPL. Reliability testing workshop

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Smart Group. New posters from The SMART Group

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Smart Group. What's new on the SMART Group Web site this month

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SMTA board of directors election results announced

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IPC. Industry gets behind IPC's lead free roadmap

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Smart Group. New Web page

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Smart Group. The interactive Lead-Free Assembly and Soldering Cook Book 2

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SMART Group recognised at Nepcon awards

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SMTA annual meeting to feature Solectron president Ko Nishimura

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IPC. APEX 2002 offers space for more exhibitors

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NPL. Thermal profiling of electronic assemblies – an NPL project

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NPL. Praise from delegates attending NPL workshop – "Encapsulation and Underfills"

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Smart Group. New SMT/conventional assembly process presentations on CD

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SMTA Dallas technical committee dedicated to optoelectronics

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NPL. Characteristics solder resist/mask performance

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NPL add store to their Web site

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Smart Group mission to Japan

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SMTA international events focus on contract manufacturing

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NPL seek partners for new project

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SSTC

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Book reviews

Contamination-free Manufacturing for Semiconductors and Other Precision Products

Brian Ellis
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Dry Film Photoresist Processing Technology

Brian Ellis
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The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material

G. Kaltenpoth; W. Siebert; X‐M. Xie; F. Stubhan
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Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders

L. Ye; Z.H. Lai; J. Liu; A. Thölén
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Ceramic chip scale package solder joint reliability

J. Seyyedi; J. Padgett
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Lead‐free reflow soldering for electronics assembly

M.R. Harrison; J.H. Vincent; H.A.H. Steen
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ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges

Johan Liu
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Editorial

Editorial

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Exhibitions/conferences

BOC Seminar – National Motor-cycle Museum, Birmingham, UK

Mike Judd
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SMT/HYBRID/PACKAGING 2001 remains strong

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Industry news

Intertronics named UK distributor for Thermoset

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Concoat acquire SoldaPro range of thermal profilers

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New company – new vision

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Siemens opens 16th training center for SMT placement technology in Seoul/South Korea

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IPC/Nemi shopfloor communications standard available for review and comment

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Feinfocus USA relocates headquarters to Stamford, Connecticut

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ESI establishes Technical Support Centre in Europe for customers

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PAF announce new distributor for France

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Hansatech wins Manufacturing Excellence category at East of England Business Awards

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Technology and recruitment – a unique partnership

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Indium Corporation of America announces solder paste price increase

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BGA rework … Protech supply the solution

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Genrad announces completion of Autodiagnos AB acquisition

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Osprey controlled expansion alloys launches new Web site

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International diary

International diary

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Internet commentary

… broad is the way, that leadeth to destruction[1]

Brian Ellis
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New products

"Viper" soldering tip range further simplifies the challenge of reworking fine pitch components

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New Pb-free solder paste from Indium

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New residue management system from Rehm

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Tin Up machine recycles used components

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Fully automated dispense robot improves the manual process

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Cookson Performance Solutions introduces groundbreaking e-learning system for the printed circuit board manufacturing industry

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New company – new standards in stencil printing

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Off-line programming speeds new board set-up for solder paste inspection

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Asymtek updates easy coat® for Windows NT® software for conformal coating systems

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SIPLACE Productivity Lift can now accommodate extra large PCBs up to 460mm in width or process two boards (up to 216mm wide) simultaneously

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Alpha delivers stand-alone Isis advantages

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Quick cure thick encapsulant

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Dymax conformal coating range improved

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Sounding out component defects

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New self-adhesive BGA rework stencils

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Asymtek announces the Century® C-740 Series Selective Conformal Coating System

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SMarT feed system feeds bulk SMT components directly to pick and place

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New silver conductive adhesive from Heraeus

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PD 966 M SMT – adhesive with extremely wide processing window

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Publications

IPC-7530: the definitive guide for temperature profiling for mass soldering (reflow and wave) processes

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Metcal publishes comprehensive fume extraction catalogue

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The definitive guides to solder paste printing

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Reports

PN launch event report

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