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Journal Articles

Ceramic chip scale package solder joint reliability

J. Seyyedi, J. Padgett

Soldering & Surface Mount Technology (2001) 13 (3): 7–11.

https://doi.org/10.1108/09540910110407351

Published: 01 December 2001

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Journal Articles

Reliability Evaluation of TSOP Solder Joints for PC Card Application

J. Seyyedi, R. lannuzzelli, J. Bukhari

Soldering & Surface Mount Technology (1996) 8 (2): 29–32.

https://doi.org/10.1108/09540919610777663

Published: 01 August 1996

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Journal Articles

Soldered Joint Reliability for Interstitial Pin Grid Array Packages

J. Seyyedi

Soldering & Surface Mount Technology (1994) 6 (3): 15–20.

https://doi.org/10.1108/eb037875

Published: 01 March 1994

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Journal Articles

Thermal Fatigue Behaviour of Low Melting Point Solder Joints

J. Seyyedi

Soldering & Surface Mount Technology (1993) 5 (1): 26–32.

https://doi.org/10.1108/eb037812

Published: 01 January 1993

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Journal Articles

Stress‐rupture and Creep Behaviour of 63Sn‐37Pb Production Soldered Connections

J. Seyyedi, B. Arsenault, J.P. Keller

Soldering & Surface Mount Technology (1991) 3 (1): 49–53.

https://doi.org/10.1108/eb037743

Published: 01 January 1991

View article titled, Stress‐rupture and Creep Behaviour of 63Sn‐37Pb Production Soldered Connections

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Journal Articles

Wearout Evaluation of Soldered Interconnections for Surface Mounted Leadless and Leaded Components

J. Seyyedi, S. Jawaid

Soldering & Surface Mount Technology (1990) 2 (1): 44–49.

https://doi.org/10.1108/eb037706

Published: 01 January 1990

View article titled, Wearout Evaluation of Soldered Interconnections for Surface Mounted Leadless and Leaded Components

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Ceramic chip scale package solder joint reliability

Reliability Evaluation of TSOP Solder Joints for PC Card Application

Soldered Joint Reliability for Interstitial Pin Grid Array Packages

Thermal Fatigue Behaviour of Low Melting Point Solder Joints

Stress‐rupture and Creep Behaviour of 63Sn‐37Pb Production Soldered Connections

Wearout Evaluation of Soldered Interconnections for Surface Mounted Leadless and Leaded Components

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