The definitive guides to solder paste printing
The definitive guides to solder paste printingKeywords: Solder paste, Printing
Dynamix Technology Ltd announces the release of IPC-VT-34 and IPC-VT-35, Guides to Solder Paste Printing. IPC-VT-34 is devoted specifically to the key elements in solder paste printing: the circuit board, stencil, solder paste and squeegee with its accompanying guide IPC-VT-35 aiming at defect analysis and prevention.
I PC-VT-34 Solder Paste Printing:
Effect of each element on the printing process.
Automatic and semi-automatic stencil printers.
Focuses on set-up and monitoring of all aspects.
Includes operator maintenance-emphasising safety and proper clean-up.
IPC-VT-35 Solder Paste Printing – Defect Analysis & Prevention:
Defines defects associated with solder paste printing and discusses probable causes.
Reviews subjects such as lack of coverage, bridging, misalignment and solder paste volume/print shape.
Offers recommended adjustments such as kneading paste and squeegee pressure.
Stresses importance of preventive maintenance.
Both videos encompass a leaders guide and student workbook.
IPC-VT-34 and IPC-VT-35 both run in conjunction with the release of IPC-7525, Stencil Design Guidelines. This defines and provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus document.
IPC-7525: The new standard includes:
Stencil design for various surface-mount technologies.
Discusses mixed technology with through-hole or flip chip components.
Overprint, two-print and step stencil designs.
For further information, contact: Peter Swanson, UK. Tel: +44 (0) 1865 370380; e-mail: dynamix@cygnetuk.demon.co.uk;WWW: http://welcome.to/dynamix/technology
