NPL. Characteristics solder resist/mask performance
NPL
Characteristics solder resist/mask performance
Keyword: NPL, Solder
Industry currently uses a number of simple ad hoc evaluation test methods that correlate poorly with the mask performance during assembly. The industry has long understood the test methods contained in national and international specifications to be inadequate. The National Physical Laboratory,NPL, is proposing to evaluate a number of test methods and show their relevance to issues experienced during assembly operations. This project will also bench-mark the current test methods with new procedures.
The project objectives and deliverables are:
To produce a code of practice to define test methods and criteria to allow companies to simply define and test printed circuit boards prior to assembly or supply.
Investigate current and new methods of assessing the degree of cure of solder masks after fabrication and prior to assembly. Define test methods, which could be economically introduced to assembly and fabrication methods.
Compare assembly defects like resist out-gassing, underfill voiding and solder balling with the variations on selected solder resist surfaces.
Propose these test methods and procedures to national and international standards committees to incorporate into future standards to reduce the variation of test results in the industry.
The first meeting was recently held at NPL and, although the level of interest from potential partners was high, there is still time for other interested companies to participate in this part in DTI funded project.
For more information contact: Dr Chris Hunt, National Physical Laboratory,Teddington, Middlesex TW11 0LW, UK. Tel: +44 (0) 20 8943 6065; Fax: +44 (0) 20 8614 0429; E-mail: chris.hunt@npl.co.uk;Web: http//www.npl.co.uk/npl/ei/
