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Journal Articles

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

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Qiaoran Zhang, Abdelhafid Zehri, Jiawen Liu, Wei Ke, Shirong Huang, Martí Gutierrez Latorre, Nan Wang, Xiuzhen Lu, Cheng Zhou, Weijuan Xia, Yanpei Wu, Lilei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (4): 193–202.
https://doi.org/10.1108/SSMT-05-2018-0014
Published: 09 May 2019
View article titled, Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
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Journal Articles

Characterization of nano-enhanced interconnect materials for fine pitch assembly

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Yan Zhang, Janusz Sitek, Jing-yu Fan, Shiwei Ma, Marek Koscielski, Lilei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 12–17.
https://doi.org/10.1108/SSMT-10-2013-0033
Published: 28 January 2014
View article titled, Characterization of nano-enhanced interconnect materials for fine pitch assembly
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Journal Articles

Surface oxide analysis of lead‐free solder particles

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Xin Luo, Wenhui Du, Xiuzhen Lu, Toshikazu Yamaguchi, Gavin Jackson, Li lei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (1): 39–44.
https://doi.org/10.1108/09540911311294588
Published: 01 February 2013
View article titled, Surface oxide analysis of lead‐free solder particles
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Journal Articles

Selected papers from HDP’07

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Johan Liu, Daoqiang Lu, Cristina Andersson
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2)
https://doi.org/10.1108/ssmt.2009.21921baa.001
Published: 10 April 2009
View article titled, Selected papers from HDP’07
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Journal Articles

Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint

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S. Chen, P. Sun, X.C. Wei, Z.N. Cheng, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 48–54.
https://doi.org/10.1108/09540910910947471
Published: 10 April 2009
View article titled, Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint
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Journal Articles

Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)

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M. Norén, S. Brunner, C. Hoffmann, W. Salz, K. Aichholzer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 24–27.
https://doi.org/10.1108/09540910910947444
Published: 10 April 2009
View article titled, Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)
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Journal Articles

A study of thermo‐mechanical reliability of lead‐free PTH solder joints

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Jennifer Nguyen, David Geiger, Dan Rooney, Dongkai Shangguan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 39–47.
https://doi.org/10.1108/09540910910947462
Published: 10 April 2009
View article titled, A study of thermo‐mechanical reliability of lead‐free PTH solder joints
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Journal Articles

Properties of two new medium temperature solders

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Chunyuan Li, Xitao Wang, Wenxia Yuan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 4–8.
https://doi.org/10.1108/09540910910947408
Published: 10 April 2009
View article titled, Properties of two new medium temperature solders
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Journal Articles

Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles

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C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 9–13.
https://doi.org/10.1108/09540910910947417
Published: 10 April 2009
View article titled, Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles
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Journal Articles

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

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C. Andersson, B. Vandevelde, C. Noritake, P. Sun, P.E. Tegehall, D.R. Andersson, G. Wetter, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 28–38.
https://doi.org/10.1108/09540910910947453
Published: 10 April 2009
View article titled, Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
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Journal Articles

The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

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Cong‐qian Cheng, Jie Zhao, Yang Xu, Fu‐Min Xu, Ming‐liang Huang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 14–18.
https://doi.org/10.1108/09540910910947426
Published: 10 April 2009
View article titled, The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields
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Journal Articles

Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging

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Ning Zhao, Hai‐tao Ma, Lai Wang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 19–23.
https://doi.org/10.1108/09540910910947435
Published: 10 April 2009
View article titled, Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging
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Journal Articles

Process and pad design optimization for 01005 passive component surface mount assembly

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Yu Wang, Michael Olorunyomi, Martin Dahlberg, Zoran Djurovic, Johan Anderson, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2007) 19 (1): 34–44.
https://doi.org/10.1108/09540910710748212
Published: 13 February 2007
View article titled, Process and pad design optimization for 01005 passive component surface mount assembly
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Journal Articles

Lead‐Free Solder Interconnection Reliability

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Bob Willis
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 58.
https://doi.org/10.1108/ssmt.2006.18.2.58.1
Published: 01 April 2006
View article titled, Lead‐Free Solder Interconnection Reliability
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Journal Articles

Guest editorial

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Chris Bailey, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2)
https://doi.org/10.1108/ssmt.2006.21918baa.001
Published: 01 April 2006
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Journal Articles

High performance anisotropic conductive adhesives for lead‐free interconnects

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Yi Li, C.P. Wong
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 33–39.
https://doi.org/10.1108/09540910610665116
Published: 01 April 2006
View article titled, High performance anisotropic conductive adhesives for lead‐free interconnects
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Journal Articles

Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly

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C.Y. Yin, H. Lu, C. Bailey, Y.C. Chan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 27–32.
https://doi.org/10.1108/09540910610665107
Published: 01 April 2006
View article titled, Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly
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Journal Articles

Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

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Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 4–11.
https://doi.org/10.1108/09540910610665071
Published: 01 April 2006
View article titled, Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint
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Journal Articles

Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder

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Masahiro Inoue, Katsuaki Suganuma
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 40–45.
https://doi.org/10.1108/09540910610665125
Published: 01 April 2006
View article titled, Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder
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Journal Articles

High strain rate testing of solder interconnections

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K.T. Tsai, F‐L. Liu, E.H. Wong, R. Rajoo
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 12–17.
https://doi.org/10.1108/09540910610665080
Published: 01 April 2006
View article titled, High strain rate testing of solder interconnections
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