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Journal Articles

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

Qiaoran Zhang, Abdelhafid Zehri, Jiawen Liu, Wei Ke, Shirong Huang, Martí Gutierrez Latorre, Nan Wang, Xiuzhen Lu, Cheng Zhou, Weijuan Xia, Yanpei Wu, Lilei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (4): 193–202.
https://doi.org/10.1108/SSMT-05-2018-0014
Published: 09 May 2019
View article titled, Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
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Journal Articles

Characterization of nano-enhanced interconnect materials for fine pitch assembly

Yan Zhang, Janusz Sitek, Jing-yu Fan, Shiwei Ma, Marek Koscielski, Lilei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 12–17.
https://doi.org/10.1108/SSMT-10-2013-0033
Published: 28 January 2014
View article titled, Characterization of nano-enhanced interconnect materials for fine pitch assembly
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Journal Articles

Surface oxide analysis of lead‐free solder particles

Xin Luo, Wenhui Du, Xiuzhen Lu, Toshikazu Yamaguchi, Gavin Jackson, Li lei Ye, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (1): 39–44.
https://doi.org/10.1108/09540911311294588
Published: 01 February 2013
View article titled, Surface oxide analysis of lead‐free solder particles
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Journal Articles

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

C. Andersson, B. Vandevelde, C. Noritake, P. Sun, P.E. Tegehall, D.R. Andersson, G. Wetter, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 28–38.
https://doi.org/10.1108/09540910910947453
Published: 10 April 2009
View article titled, Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
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Journal Articles

The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Cong‐qian Cheng, Jie Zhao, Yang Xu, Fu‐Min Xu, Ming‐liang Huang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 14–18.
https://doi.org/10.1108/09540910910947426
Published: 10 April 2009
View article titled, The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields
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Journal Articles

Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles

C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 9–13.
https://doi.org/10.1108/09540910910947417
Published: 10 April 2009
View article titled, Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles
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Journal Articles

Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging

Ning Zhao, Hai‐tao Ma, Lai Wang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 19–23.
https://doi.org/10.1108/09540910910947435
Published: 10 April 2009
View article titled, Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging
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Journal Articles

Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)

M. Norén, S. Brunner, C. Hoffmann, W. Salz, K. Aichholzer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 24–27.
https://doi.org/10.1108/09540910910947444
Published: 10 April 2009
View article titled, Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)
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Journal Articles

A study of thermo‐mechanical reliability of lead‐free PTH solder joints

Jennifer Nguyen, David Geiger, Dan Rooney, Dongkai Shangguan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 39–47.
https://doi.org/10.1108/09540910910947462
Published: 10 April 2009
View article titled, A study of thermo‐mechanical reliability of lead‐free PTH solder joints
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Journal Articles

Selected papers from HDP’07

Johan Liu, Daoqiang Lu, Cristina Andersson
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2)
https://doi.org/10.1108/ssmt.2009.21921baa.001
Published: 10 April 2009
View article titled, Selected papers from HDP’07
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Journal Articles

Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint

S. Chen, P. Sun, X.C. Wei, Z.N. Cheng, J. Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 48–54.
https://doi.org/10.1108/09540910910947471
Published: 10 April 2009
View article titled, Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint
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Journal Articles

Properties of two new medium temperature solders

Chunyuan Li, Xitao Wang, Wenxia Yuan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 4–8.
https://doi.org/10.1108/09540910910947408
Published: 10 April 2009
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Journal Articles

Process and pad design optimization for 01005 passive component surface mount assembly

Yu Wang, Michael Olorunyomi, Martin Dahlberg, Zoran Djurovic, Johan Anderson, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2007) 19 (1): 34–44.
https://doi.org/10.1108/09540910710748212
Published: 13 February 2007
View article titled, Process and pad design optimization for 01005 passive component surface mount assembly
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Journal Articles

Finite element analysis of fleXBGA reliability

Gang Chen, Xu Chen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 46–53.
https://doi.org/10.1108/09540910610665134
Published: 01 April 2006
View article titled, Finite element analysis of fleXBGA reliability
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Journal Articles

High strain rate testing of solder interconnections

K.T. Tsai, F‐L. Liu, E.H. Wong, R. Rajoo
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 12–17.
https://doi.org/10.1108/09540910610665080
Published: 01 April 2006
View article titled, High strain rate testing of solder interconnections
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Journal Articles

Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Li‐Yin Hsiao, Jenq‐Gong Duh
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 18–26.
https://doi.org/10.1108/09540910610665099
Published: 01 April 2006
View article titled, Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging
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Journal Articles

Lead‐Free Solder Interconnection Reliability

Bob Willis
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 58.
https://doi.org/10.1108/ssmt.2006.18.2.58.1
Published: 01 April 2006
View article titled, Lead‐Free Solder Interconnection Reliability
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Journal Articles

Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 4–11.
https://doi.org/10.1108/09540910610665071
Published: 01 April 2006
View article titled, Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint
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Journal Articles

Guest editorial

Chris Bailey, Johan Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2)
https://doi.org/10.1108/ssmt.2006.21918baa.001
Published: 01 April 2006
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Journal Articles

High performance anisotropic conductive adhesives for lead‐free interconnects

Yi Li, C.P. Wong
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 33–39.
https://doi.org/10.1108/09540910610665116
Published: 01 April 2006
View article titled, High performance anisotropic conductive adhesives for lead‐free interconnects
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