Promising new substrate materials for PC boards

Promising new substrate materials for PC boards

Keywords: Substrates, Printed circuit boards, Japan

(Chemical Business NewsBase – Japan Chemical Week) The potential of polynorbornene resin (PNB), benzocyclobutene resin (BCB) and polyphenylene oxide resins (PPO) to act as substitutes for epoxy resins in printed circuit boards and module substrates has been confirmed by a consortium consisting of Sumitomo Bakelite, Toray, Hitachi Chemical and two other unnamed Japanese companies because of their very good electrical properties. The consortium is known as the Technology Research Association for Advanced Jisso Functional Materials. Development targets with low dielectric constant and low dielectric dissipation will be developed by the consortium using nanohybridisation and the formation of composites using filler additives and metal foil layers. The inorganic fillers being considered include barium titanate, strontium titanate,titanium dioxide and calcium zirconate. Means of obtaining optimum signal processing at high speed and volume are being considered by bonding metal surfaces of conductive and insulation layers.