Issues

Association news

IPC/Soldertec conference on lead-free electronics – an international success!

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IPC releases 2002/2003 Technology Roadmap

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2003 Hutchins grant award recipient announced

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Thermal strain analysis of an electronics package using the SEM Moiré technique

Z.W. Zhong; S.K. Nah
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Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures

H. Rhee; K.N. Subramanian; A. Lee; J.G. Lee
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Failures of flip chip assemblies under thermal shock

Cheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe
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Flip chip solder joint reliability under harsh environment

Cheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe
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Improving the fatigue life of a bare die flip chip by thinning

T. Alander; I. Suominen; P. Heino; E. Ristolainen
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Editorial

Editorial

David Whalley
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Exhibitions/seminars

First in series of NPL Lead-Free Master Classes is well received

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NPL ensure success of the "Hands-On lead-free experience" at Nepcon show

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Industry news

Electronic Scientific Engineering acquires Macrotron GmbH

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Universal teams with CALCE to enhance packaging and assembly analysis

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Eastern Europe to emerge as serious mobile player

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Soldertec Global seeks nominations for Lead-free Solder Awards 2003

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Conference and exhibition on microsystem packaging and manufacturing

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Semtronics sold to Desco Industries, Inc.

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Founder Group chooses Glasgow for European HQ

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Foxconn Hon Hai launches USD 45 million greenfield investment

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EKRA and Speedline mend fences

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International diary

International diary

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Internet commentary

Internet commentary

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Literati Club

Awards for Excellence

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New products

Heraeus introduces top performing no-clean solder paste

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Metcal rework system now bigger and better

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Promising new substrate materials for PC boards

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Computed tomography in the micron range

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Contamination testers help eliminate rework costs and field failures

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AIM develops lead-free pin probe testable no-clean solder paste

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Orbotech introduces new Verifast21™

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Note from the publisher

Brian Ellis wins an Outstanding Service Award at the Literati Awards for Excellence 2003

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