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Journal Articles

Failures of flip chip assemblies under thermal shock

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Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang Kempe
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (3): 27–32.
https://doi.org/10.1108/09540910310505099
Published: 01 December 2003
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Journal Articles

Flip chip solder joint reliability under harsh environment

Available to Purchase
Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang Kempe
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (3): 15–20.
https://doi.org/10.1108/09540910310505071
Published: 01 December 2003
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