SSTC Winter Conference concentrates on lead-free solder reliability
SSTC Winter Conference concentrates on lead-free solder reliability
Keywords: Electronics industry, Conferences, Surface mount technology
NPLs Soldering Science & Technology Club Winter Conference included an update on RoHS from DTI, plus invited presentations on the latest research from world leading Swedish Institute of Metals Research, Loughborough and Greenwich University (Plate 1).
In addition the most recent research from DTI funded projects at NPL was presented.
Plate 1Speakers from the NPL conference
In the RoHS overview and update, James Lidgard from DTI stated: “Our view of the compliance and enforcement regime has not changed from that set out in the DTIs non-statutory draft RoHS guidance document, which was published as part of the last WEEE/ RoHS consultation in July. The UK intends to accept self-declaration as the basis of the compliance regime. Any item of electrical or electronic equipment (EEE) placed on the market will be assumed to comply with the RoHS Regulations. The enforcement authority will carry out market surveillance and may challenge any producer that it suspects of placing non-compliant EEE on the market. A defence of due diligence will be available where the producer can show that all reasonable steps were taken to avoid committing an offence. This may include reference to an act or default or information given by a third party”.
The remaining programme, chaired by Jim Vincent, Bookham Technology,included:
Measuring Tin Whiskering Propensity with XRD, Chris Hunt – NPL;
Fatigue Properties of Sn3.5Ag0.7Cu Solder Joints and Effects of Pb-contamination, James Oliver – SIMR;
Overmoulding of Electronics with Recyclable Polymers, David Whalley/David Hutt – Loughborough University;
Effect of Microstructure, PCB Finish and Processing on LF Reliability, Milos Dusek – NPL;
Measuring Voiding Levels in a range of Lead-Free Solder Pastes, Martin Wickham – NPL;
The Compatibility of Pb-Free Solder with Different Metallisations, James Oliver – SIMR;
Lead Distribution in Contaminated LF Joints and Studio Update, Martin Wickham – NPL;
A New Test Method for Lead-Free Solder Joint Reliability, Milos Dusek– NPL;
Modelling New Damage Mechanisms for Lead-free Solders, Chris Bailey/Steve Rideout – Greenwich University.
For further information, visit the web site: www.npl.co.uk/ei/
