Issues

Appointments

New product manager for DEK European Distributed Products (Consumables)

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Book reviews

Implementing Lead-Free Electronics

Bob Willis
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Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits

Brian Ellis
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IC Component Sockets

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Starting Electronics

Brian Ellis
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A systematic procedure for the selection of a lead‐free solder paste in an electronics manufacturing environment

Girish S. Wable; Quyen Chu; Purushothaman Damodaran; Krishnaswami Srihari
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Fluxless plasma bumping of lead‐free solders and the reliability effects of under bump metallization thickness

Joon Kwon Moon; Y. Zhou; Jae Pil Jung
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The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing

M.J. Rizvi; Y.C. Chan; C. Bailey; H. Lu; A. Sharif
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Microstructural investigation of lead‐free BGAs soldered with tin‐lead solder

Günter Grossmann; Joy Tharian; Pascal Jud; Urs Sennhauser
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The impact of thermal cycling regime on the shear strength of lead‐free solder joints

Milos Dusek; Martin Wickham; Christopher Hunt
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Exhibitions and conferences

SSTC Winter Conference concentrates on lead-free solder reliability

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EIPC Winter Conference, Barcelona, Spain, 27-28 January 2005

John Ling
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SMART Group 7th Annual Lead Free Conference, High Wycombe, Buckinghamshire, 3 February 2005

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Industry news

eXception Group Limited acquire certain DDi Europe businesses

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Contax helps MRP electronics eliminate micro-cracking

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Universal Instruments’ exemplary customer service receives a Frost & Sullivan Award

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CorinTech awarded BSI Kitemark IPC-A-610C licence

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DEK and Stork join forces to develop electroform stencils for SMT industry

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Axiom fly the UK’s first lead-free Kitemark

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Jaltek Systems – process control equals product quality

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Universal Instruments named a “Most Influential Enterprise” in China

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International diary

International diary

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Internet commentary

A certain fox, it is said, wanted to become a wolf

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Letter to the editor

Letter to the editor

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New products

Online maintenance gets even more Interactiv™

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Contax announces Speedline next generation stencil printer

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Henkel introduces new low temperature cure, lead-free compatible surface mount adhesive

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New thermally conductive, electrically insulating epoxy resists up to 500°F

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New flexible pick and place from Contax

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New zero defects testing system

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Henkel's lead-free solder paste exhibits exceptional humidity resistance

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New high-power X-ray target from FEINFOCUS

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INTERTRONICS launch Permalex Squeegees to improve printing with lead-free paste

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Obituary

Professor Eero Ristolainen

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Publications

Lead-Free Solder Interconnect Reliability

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