Henkel introduces new low temperature cure, lead-free compatible surface mount adhesive
Henkel introduces new low temperature cure, lead-free compatible surface mount adhesive
Keywords: Surface mount technology, Adhesives
The Henkel Group have announced Loctite® 3629, a low temperature cure epoxy adhesive. The new material is particularly well suited for high speed dispensing on a range of industry standard machines including ProFlow® cassettes for printing.
Designed to meet the needs of the world's leading consumer electronics companies, Loctite 3629 has been successfully tested in lead free production environments.
Its low temperature cure requirement makes it ideal for applications where heat sensitive materials, such as light emitting diodes (LED) and FR2 boards,need to be bonded prior to wave soldering. Lower curing oven temperatures required for Loctite 3629 also offer cost savings through reduced energy use.
Loctite 3629 also meets the highest standards of on-board reliability testing such as SIR testing. It is suitable for use on PCBs in high reliability equipment used in harsh operating environments.
Its unique colour makes operator visual inspection easier than most grades available on the market and the uncured adhesive is fluorescent under UV light.
Loctite 3629 is available in a wide range of industry standard syringes and cassettes and offers a cost-effective solution for PCB manufactures with the need for a reliable process and end product.
