International diary

Article Type: International diary From: Soldering & Surface Mount Technology, Volume 21, Issue 2

2009

KPCA Show

22-24 AprilKintex, KoreaContact: web site: www.kpca-show.co.kr

SMT/Hybrid/Packaging

5-7 MayNuremburg, GermanyContact: web site: www.mesago.de/en/SMT/main.htm

Electronic Components and Technology Conference (ECTC2009)

27-29 MaySan Diego, CA, USAContact: web site: www.ectc.net

JPCA Show

3-5 JuneBig Sight, TokyoContact: web site: www.jpca.org.jp

EMPC 2009 – 17th European Microelectronics and Packaging Conference and Exhibition

14-17 JuneContact: web site: www.empc2009.org/

EIPC Summer Conference

17-19 JuneGraz, AustriaContact: web site: www.eipc.org

2009 International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP)

10-13 AugustBeijing, ChinaContact: web site: www.icept.org

IPC Midwest Conference & Exhibition

20-24 SeptemberSchaumberg, IL, USAContact: web site: www.ipc.org

SMART Group Conference & Exhibition

30 September-1 OctoberCoventry, UKContact: web site: www.smartgroup.org