Issues

Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration HDP'07. Guest Editors: Johan Liu, Daoqiang Lu, Cristina Andersson

Appointments

DEK Solar expands global reach with new additions

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SMART Group Elect Keith Bryant as New Chairman

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Properties of two new medium temperature solders

Chunyuan Li; Xitao Wang; Wenxia Yuan
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The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Cong‐qian Cheng; Jie Zhao; Yang Xu; Fu‐Min Xu; Ming‐liang Huang
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Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging

Ning Zhao; Hai‐tao Ma; Lai Wang
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Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles

C.D. Zou; Y.L. Gao; B. Yang; Q.J. Zhai; C. Andersson; J. Liu
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Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint

S. Chen; P. Sun; X.C. Wei; Z.N. Cheng; J. Liu
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Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)

M. Norén; S. Brunner; C. Hoffmann; W. Salz; K. Aichholzer
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Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

C. Andersson; B. Vandevelde; C. Noritake; P. Sun; P.E. Tegehall; D.R. Andersson; G. Wetter; J. Liu
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A study of thermo‐mechanical reliability of lead‐free PTH solder joints

Jennifer Nguyen; David Geiger; Dan Rooney; Dongkai Shangguan
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Exhibitions and conferences

EPTC 2008, Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne, Waterfront Hotel, Singapore

Martin Goosey
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iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport

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Guest editorial

Selected papers from HDP’07

Johan Liu; Daoqiang Lu; Cristina Andersson
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Industry news

New Siemens SMT insights technology brochure covers “Vision”: why vision systems are so important in electronics production

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Metcal customers go for gold with proven solder technologies

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PartnerTech adds new SMT line and AOI equipment to Cambridge NPI facility

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International diary

International diary

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New products

HumiSeal® redefines conformal coating selection with launch of industry leading web site

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Essemtec launch new semi-automatic printer in the UK

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Aries Electronics patented CSP/BallNest hybrid socket provides reliable, consistent test and burn-in down to 0.30 mm pitch

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ThreeBond 1530 elastic adhesive

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Intertronics moves conformal coating ahead of the game

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Metcal launches new state-of-the-art web site

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The Highway Code of Stencils

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