Aries Electronics patented CSP/BallNest hybrid socket provides reliable, consistent test and burn-in down to 0.30 mm pitch

Article Type: New products From: Soldering & Surface Mount Technology, Volume 21, Issue 2

Aries Electronics have announced its new patented chip scale package(CSP)/BallNest hybrid socket (Figure 1) suitable for prototyping, test or burn-in of CSP, BGA (ball grid array), microBGA and land grid array devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30 mm pitch or larger.

The zero insertion force-style socket uses Aries solderless, gold-plated pressure mount spring probes, allowing for easy mounting and removal from the printed circuit board (PCB). The design maintains constant force throughout the entire test and burn-in cycle as well as on the surface mount PCB when no chip is engaged.

The socket bolts down onto the target PCB in the same footprint as the socketed device. This process also enables the socket to be mounted to an adapter board terminated with male thru-pins effectively creating a thru-hole solder tail socket for BGA devices. The socket cover can also incorporate heat sinks for added test and burn-in flexibility.

A four-point crown ensures “scrub” on solder oxides. The gold-over-nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls, further increasing reliability.

With a signal path of only 0.077 inches (1.96 mm), Aries’ new socket provides minimal signal loss for higher bandwidth capability. Special lid designs and materials are available upon request.

The compression spring probes in the Aries CSP/BallNest hybrid sockets are constructed from heat-treated beryllium-copper with 30 μm in. min(0.75 μm mm) gold per Mil-G-45204 over 30 μm min(0.75 μm mm) minimum. The socket body is PEEK or Torlon, while screws and alignment pins are stainless steel and all inserts are tin-plated brass alloy per QQ-B-626.

The socket’s contact forces are 15 g per contact on a 0.30-0.35 mm pitch, 16 g per contact on a 0.40-0.45 mm pitch, 25 g per contact on a 0.50-0.75 mm pitch and 25 g per contact on a 0.80 mm pitch or larger. Operating temperature is −55 to 150°C (−67 to 302°F) and estimated contact life is 500,000 cycles.

As with all Aries sockets, the new test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

A BallNest socket for a typical 50 lead BGA device with 0.3 mm pitch is$500 each at quantity two pieces. Delivery is 5-6 weeks ARO.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, PA. 19007-6810; Tel.: 215 781 9956; Fax: 215-781-9845; e-mail: info@arieselec.com,web site: www.arieselec.com,Data sheet no. 23016 – web site: www.arieselec.com/Web_Data_Sheets/23016/23016.htm;Europe e-mail: europe@arieselec.com