Issues

Multiphysics simulation of microwave curing in micro‐electronics packaging applications

T. Tilford; K.I. Sinclair; C. Bailey; M.P.Y. Desmulliez; G. Goussettis; A.K. Parrott; A.J. Sangster
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Reduced temperature soldering of capacitors using Sn‐Bi plated Sn‐3.5%Ag

Mi Jin Kim; Y. (Norman) Zhou; Jae Pil Jung
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Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC

Olli Nousiainen; Tero Kangasvieri; Kari Rönkä; Risto Rautioaho; Jouko Vähäkangas
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The evolution of paste pressure during stencil printing

David J. Clements; Marc P.Y. Desmulliez; Eitan Abraham
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Exhibitions and conferences

NEPCON 2007 National Exhibition Centre, Birmingham, 14-16 May 2007

J. H. Ling
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EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007

Martin Goosey
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Industry news

Assembléon partners with HIN to strengthen sales and service in Denmark

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Advanced directory solves the problems of solder stencil efficiency

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RoHS reliability – success or failure?

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IONMET – new ionic liquid solvent technology to transform metal finishing

Pete Starkey
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New products

Assembléon's latest A-Series pick and place machine handles a very wide component range with 20 micron accuracy

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Siplace D2 and D1: new Siemens placement machines for electronics manufacturers with medium-sized volumes and the highest quality requirements

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Siplace Maintenance Manager: The right maintenance at the right time – for any line component

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New valves from Intertronics dispense micro-dots in all viscosities

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RMD Instruments LeadTracer- RoHS XRF shown at Nepcon UK

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BPM Microsystems display the next generation of the Helix Automated Device Programmer at Nepcon UK 2007

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Portable, localised fume extractor for improved productivity

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