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Issue
13 February - Volume 19, Issue 1, Pages 4 - 44
17 April - Volume 19, Issue 2, Pages 4 - 38
3 July - Volume 19, Issue 3, Pages 3 - 33
25 September - Volume 19, Issue 4, Pages 3 - 32
Volume 19, Issue 3
3 July 2007
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Exhibitions and conferences
Industry news
New products
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Multiphysics simulation of microwave curing in micro‐electronics packaging applications
T. Tilford
;
K.I. Sinclair
;
C. Bailey
;
M.P.Y. Desmulliez
;
G. Goussettis
;
A.K. Parrott
;
A.J. Sangster
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Reduced temperature soldering of capacitors using Sn‐Bi plated Sn‐3.5%Ag
Mi Jin Kim
;
Y. (Norman) Zhou
;
Jae Pil Jung
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Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC
Olli Nousiainen
;
Tero Kangasvieri
;
Kari Rönkä
;
Risto Rautioaho
;
Jouko Vähäkangas
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The evolution of paste pressure during stencil printing
David J. Clements
;
Marc P.Y. Desmulliez
;
Eitan Abraham
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Exhibitions and conferences
NEPCON 2007 National Exhibition Centre, Birmingham, 14-16 May 2007
J. H. Ling
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EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007
Martin Goosey
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Industry news
Assembléon partners with HIN to strengthen sales and service in Denmark
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Advanced directory solves the problems of solder stencil efficiency
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RoHS reliability – success or failure?
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IONMET – new ionic liquid solvent technology to transform metal finishing
Pete Starkey
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New products
Assembléon's latest A-Series pick and place machine handles a very wide component range with 20 micron accuracy
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Siplace D2 and D1: new Siemens placement machines for electronics manufacturers with medium-sized volumes and the highest quality requirements
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Siplace Maintenance Manager: The right maintenance at the right time – for any line component
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New valves from Intertronics dispense micro-dots in all viscosities
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RMD Instruments LeadTracer- RoHS XRF shown at Nepcon UK
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BPM Microsystems display the next generation of the Helix Automated Device Programmer at Nepcon UK 2007
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Portable, localised fume extractor for improved productivity
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Latest
Most Read
Most Cited
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
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