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Issue
6 February - Volume 21, Issue 1, Pages 4 - 41
10 April - Volume 21, Issue 2, Pages 4 - 54
26 June - Volume 21, Issue 3, Pages 4 - 46
18 September - Volume 21, Issue 4, Pages 4 - 54
Volume 21, Issue 1
6 February 2009
All Issues
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Cover Image
ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
Editorial
Exhibitions and conferences
Industry news
International diary
New products
Issue Navigation
Appointments
ASML Supervisory Board nominates Pauline van der Meer Mohr as new member
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OK International appoints new China Sales Director
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Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer
Kyoo‐Seok Kim
;
Jae‐Pil Jung
;
Y. Norman Zhou
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Geometry control of solder interconnects via induction heating
Hongbo Xu
;
Mingyu Li
;
Yonggao Fu
;
Ling Wang
;
Jongmyung Kim
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Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis
Chang‐Chun Lee
;
Kuo‐Chin Chang
;
Ya‐Wen Yang
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Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
Stoyan Stoyanov
;
Chris Bailey
;
Marc Desmulliez
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Editorial
Editorial
Martin Goosey
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Exhibitions and conferences
ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London
Martin Goosey
;
Darren Cadman
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Industry news
DEK solar offers fast-track to efficient commercial photovoltaic production
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Novatec continues their tradition of breakthrough technologies at Forum de lelectronique
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Surface mounting (the equine version) from Intertronics
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Low-cost Panasonic CM101 modular placement machine wins tough selection battle at Murata Power Solutions
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High bar count metal encoder disks enable accurate optical measurement and control
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Advanced directory solves the problems of solder stencil efficiency
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HumiSeal® redefines conformal coating selection with launch of industry leading website
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IET to sign up with UKRCs CEO charter
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International diary
International diary
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New products
DEK boosts throughput and flexibility with new Dual Lane RTC platform
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New Universal AdVantisX from Contax – Genesis Technology on a Budget
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New OK International Multi-Function Rework System provides process control, value and flexibility
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DEK extends Instinctiv™ V9 software capabilities with 2D inspection control
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Intertronics – fine mist lubricant system
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Second generation C5 from Contax cost-effective high throughput placement system
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ThreeBond 30F-404 UV/visible light cure adhesive
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Latest
Most Read
Most Cited
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
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