Issues

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

De‐Shin Liu; Chang‐Lin Hsu; Chia‐Yuan Kuo; Ya‐Ling Huang; Kwang‐Lung Lin; Geng‐Shin Shen
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A review of stencil printing for microelectronic packaging

Robert Kay; Marc Desmulliez
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Through lifetime monitoring of solder joints using acoustic micro imaging

Ryan S.H. Yang; Derek R. Braden; Guang‐Ming Zhang; David M. Harvey
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Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders

Krystyna Bukat; Janusz Sitek; Marek Koscielski; Zbigniew Moser; Wladyslaw Gasior; Janusz Pstrus
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A new conformal coating adhesion test for electronic assemblies

Ling Zou; Chris Hunt
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Editorial

Editorial

Martin Goosey
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Exhibitions and conferences

Smart Group Annual Conference 2011 The Oxfordshire, Thame, England 5 and 6 October 2011

John Ling
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IeMRC 6th Annual Conference Loughborough University 21 September 2011

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A day at the European Microelectronics Packaging Conference Brighton, Sussex 12-15 September 2011

John Ling
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Industry news

Computrol invests in another Tucano Screen Printer from Essemtec

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Capacity-on-demand thanks to switchable gantries

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Post-assembly test for PCBs

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Deltec selects 3-D SPI system from Viscom

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Super Dry launches oxidation-free process alternative to MSD and PCB baking

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EUROPE-SMT celebrates two-year anniversary

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Triumph chooses Synergy from MYDATA

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Nihon Superior debuts selector guide for SN100C solder pastes

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Global surface mount technology equipment market to reach US$11.2 billion by 2017 – Global Industry Analysts, Inc

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Rehm delivers its 3,000th soldering system

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Avoid wasting time, material and capacity

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AIM opens office in Bangalore, India

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VarioSystems focuses on the future with SIPLACE SX

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Etek Europe launches latest division for consumables and production equipment

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Etek Europe appointed to represent JBC Tools, Inc. in the UK

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Israeli EMS provider invests in scalable SIPLACE SX line

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BTU International awarded best exhibit technology of the year at NEPCON South China 2011 for its PYRAMAX™ 125N

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Intertronics new exclusive UK distributor for preeflow® dispensing equipment

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SIPLACE grants insights into its technology developments

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International diary

International diary

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New products

Nihon Superior introduces SN100C (551CT)

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OKI launches powerful new desoldering system and introduces unique upgrade option

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GE presents its phoenix x||aminer, high magnification X-ray inspection solution for electronics manufacture

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DEK introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating

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