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Issue
1 February - Volume 25, Issue 1, Pages 4 - 50
5 April - Volume 25, Issue 2, Pages 68 - 127
21 June - Volume 25, Issue 3, Pages 139 - 183
13 September - Volume 25, Issue 4, Pages 195 - 250
Volume 25, Issue 4
13 September 2013
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
Conferences and exhibitions
Industry news
International diary
New products
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Appointments
New Viscom representative in Poland: JSD Polska
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Viscoms Michael Mügge is named the new deputy head of the FED regional group Hanover
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DEK appoints Jens Katschke to engineer advanced print solutions for customers
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A review: influence of nano particles reinforced on solder alloy
Ervina Efzan Mhd Noor
;
Amares Singh
;
Yap Tze Chuan
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Cu filling of TSV using various current forms for three‐dimensional packaging application
Myong‐Hoon Roh
;
Jun‐Hyeong Lee
;
Wonjoong Kim
;
Jea Pil Jung
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Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material
Si Chen
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A study into the re‐processing of pure tin termination finishes into tin‐lead
Ian C. Turner
;
Barrie D. Dunn
;
Cathy Barnes
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SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure
Krystyna Bukat
;
Janusz Sitek
;
Marek Koscielski
;
Wojciech Niedzwiedz
;
Anna Mlozniak
;
Malgorzata Jakubowska
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Conferences and exhibitions
Design, Manufacture and Test of High Reliability Electronics SMART Group Seminar
Pete Starkey
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“The Scorpion brings a breath of fresh air
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Industry news
Carolina Electronic Assemblers, Inc. places order for large board line from Juki
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Assembléon released White Paper on embedded components
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Juki Corporation and Cogiscan introduce IFS-NX to the worldwide market
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Leading contract manufacturer in Michigan purchases its fifth Juki SMT line
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SEHO introduces machine communication across locations
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Growth in oil and gas sector drives investment in new geographies and equipment at eXception EMS
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Datest completes recertification audit for ISO9001/AS9100C
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Still waiting for a solid upturn – Walt Custer
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End markets
Walt Custer
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AB Electronic sells the fourth Speedprint screen printer this year
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Notice concerning conclusion of formal agreement relating to integration of SMT equipment and related businesses
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International diary
International diary
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New products
New software feature from BPM Microsystems improves tape loader teaching process
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AIM Solder announces the release of NC277 VOC-free liquid flux
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FCT Assembly develops new low-melting tin/bismuth solder paste
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Latest
Most Read
Most Cited
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
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