Issues

Reflow profiling with the aid of machine learning models

Yangyang Lai; Seungbae Park
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Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study

Ao Zhang; Jian Zhang; Mingjun Zhang; Junyi Liu; Ping Peng
View articletitled, Interfacial behavior and mechanism of brazed diamond with CeO<sub>2</sub>-added Ni-Cr filler alloy: a combined first-principles and experimental study
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Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films

Vali Dalouji; Nasim Rahimi
View articletitled, Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films
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Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Shaoyi Liu; Song Xue; Peiyuan Lian; Jianlun Huang; Zhihai Wang; Lihao Ping; Congsi Wang
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Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process

Zuraihana Bachok; Aizat Abas; Hehgeraj A/L Raja Gobal; Norwahida Yusoff; Mohamad Riduwan Ramli; Mohamad Fikri Mohd Sharif; Fakhrozi Che Ani; Muhamed Abdul Fatah Muhamed Mukhtar
View articletitled, Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process
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Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Mohammad A. Gharaibeh; Faris M. Al-Oqla
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Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness

Yuzhu Han; Jieshi Chen; Shuye Zhang; Zhishui Yu
View articletitled, Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness
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