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Ben Hoi Wai Lui
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Journal Articles
Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders
Available to PurchaseShi‐Wei Ricky Lee, Ben Hoi Wai Lui, Y.H. Kong, Bernard Baylon, Timothy Leung, Pompeo Umali, Hector Agtarap
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (3): 46–50.
Published: 01 December 2002
