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Journal Articles

Evidence that Visual Inspection Criteria for Soldered Joints are no Indication of Reliability

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1991) 3 (3): 19–24.
https://doi.org/10.1108/eb037765
Published: 01 March 1991
View article titled, Evidence that Visual Inspection Criteria for Soldered Joints are no Indication of Reliability
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Journal Articles

After CFCs: Option: Semi‐aqueous Non‐volatile Solvents

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1991) 3 (3): 28–33.
https://doi.org/10.1108/eb037767
Published: 01 March 1991
View article titled, After CFCs: Option: Semi‐aqueous Non‐volatile Solvents
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 6: An Inter‐laboratory Comparison of Wetting Balance Measurements

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1991) 3 (2): 4–12.
https://doi.org/10.1108/eb037749
Published: 01 February 1991
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 6: An Inter‐laboratory Comparison of Wetting Balance Measurements
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 5: Wetting Balance Instrumental Parameters and Procedures

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1991) 3 (1): 10–13.
https://doi.org/10.1108/eb037739
Published: 01 January 1991
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 5: Wetting Balance Instrumental Parameters and Procedures
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 4: Wetting Balance Instrument Thermal Design

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1990) 2 (3): 4–9.
https://doi.org/10.1108/eb037728
Published: 01 March 1990
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 4: Wetting Balance Instrument Thermal Design
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Journal Articles

The Harmfulness of Re‐working Cosmetically Defective Solder Joints

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1990) 2 (2): 4–9.
https://doi.org/10.1108/eb037712
Published: 01 February 1990
View article titled, The Harmfulness of Re‐working Cosmetically Defective Solder Joints
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 3: Surfaces of Standard Solderability

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1990) 2 (2): 46–55.
https://doi.org/10.1108/eb037719
Published: 01 February 1990
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 3: Surfaces of Standard Solderability
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 2: An Index of Solderability

C. Lea, W.A. Dench
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1990) 2 (1): 14–22.
https://doi.org/10.1108/eb037702
Published: 01 January 1990
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 2: An Index of Solderability
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Journal Articles

Quantitative Solderability Measurement of Electronic Components: Part 1: The Wetting Balance

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1990) 2 (1): 8–13.
https://doi.org/10.1108/eb037701
Published: 01 January 1990
View article titled, Quantitative Solderability Measurement of Electronic Components: Part 1: The Wetting Balance
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Journal Articles

Moisture Induced Failure in Plastic Surface Mount Packages

C. Lea, D. Tilbrook
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1989) 1 (3): 30–34.
https://doi.org/10.1108/eb037689
Published: 01 March 1989
View article titled, Moisture Induced Failure in Plastic Surface Mount Packages
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Journal Articles

A Call for Action on CFC Usage: Some Facts for Managerial Decisions

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1989) 1 (2): 69–70.
https://doi.org/10.1108/eb037680
Published: 01 February 1989
View article titled, A Call for Action on CFC Usage: Some Facts for Managerial Decisions
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Journal Articles

Laser Soldering — Production and Microstructural Benefits for SMT

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1989) 1 (2): 13–21.
https://doi.org/10.1108/eb037672
Published: 01 February 1989
View article titled, Laser Soldering — Production and Microstructural Benefits for SMT
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Journal Articles

Heat Transfer Fluids for Vapour Phase Soldering — An Appraisal

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1989) 1 (1): 23–32.
https://doi.org/10.1108/eb037661
Published: 01 January 1989
View article titled, Heat Transfer Fluids for Vapour Phase Soldering — An Appraisal
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Journal Articles

Surface Mount Technology Trade and Professional Associations

C. Lea
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1989) 1 (1): 58–60.
https://doi.org/10.1108/eb037665
Published: 01 January 1989
View article titled, Surface Mount Technology Trade and Professional Associations
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