Skip to Main Content
Chiapyng Lee
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs

Available to Purchase
Meng‐Kuang Huang, Chiapyng Lee
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (3): 18–25.
https://doi.org/10.1108/09540910810885688
Published: 27 June 2008
View article titled, Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs
Open the PDF for Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs in another window
Add to Citation Manager for Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs
Journal Articles

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Available to Purchase
Meng‐Kuang Huang, Chiapyng Lee, Pei‐Lin Wu, Shyh‐Rong Tzan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (3): 3–8.
https://doi.org/10.1108/09540910510613501
Published: 01 September 2005
View article titled, The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
Open the PDF for The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints in another window
Add to Citation Manager for The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal