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Chuan Hu
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Journal Articles
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (1): 39–50.
Published: 13 September 2023
Includes: Supplementary data
