Skip to Main Content
Fei Lin
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing

Available to Purchase
Guokui Ju, Fei Lin, Wenzhen Bi, Yongjiu Han, Wang Junjie, Xicheng Wei
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (4): 173–179.
https://doi.org/10.1108/SSMT-08-2013-0022
Published: 26 August 2014
View article titled, Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing
Open the PDF for Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing in another window
Add to Citation Manager for Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing
Journal Articles

Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

Available to Purchase
Wenzhen Bi, Guokui Ju, Fei Lin, Shifang Xie, Xicheng Wei
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (4): 249–256.
https://doi.org/10.1108/09540911211262539
Published: 14 September 2012
View article titled, Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints
Open the PDF for Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints in another window
Add to Citation Manager for Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal