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Journal Articles

Statistical analysis of stencil technology for wafer-level bumping

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Robert W. Kay, Gerard Cummins, Thomas Krebs, Richard Lathrop, Eitan Abraham, Marc Desmulliez
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (2): 71–78.
https://doi.org/10.1108/SSMT-07-2013-0017
Published: 01 April 2014
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